Spark plasma sintering （SPS） was used to fabricate Al/diamond composites. The influence of diamond particle size on the microstructure and thermal conductivity （TC） of composites was investigated by combining experimental results with model prediction. The results show that both composites with 40 pan particles and 70 μm particles exhibit high density and good TC, and the composite with 70 μm particles indicates an excellent TC of 325 W.m^-1.K^-1. Their TCs lay between the theoretical estimated bounds. In contrast, the composite with 100 lain particles demonstrates low density as well as poor TC due to its high porosity and weak interfacial bonding. Its TC is even considerably less than the lower bound of the predicted value. Using larger diamond particles can further enhance thermal conductive performance only based on the premise that highly dense composites of strong interfacial bonding can be obtained.
CHU Ke JIA Chengchang LIANG Xuebing CHEN Hui GAO Wenji
In this paper, the two-flume method was used to study the change laws of the thermal conductivity and thermal expansion coefficient of diamond/Cu composite materials with 100, 300, and 500 cycle numbers, under the action of thermal shock load between-196 and 85 °C; the X-ray diffraction method（XRD） was used to study the change of the residual stress in the thermal shock process of the diamond/Cu composite materials; and the evolution of the fracture microstructure with different thermal shock cycle numbers was observed through scanning electron microscopy（SEM）. The results of the study show that the increase of the binder residue at the interface reduces the thermal shock stability of the diamond/Cu composite materials. In addition, under the thermal shock load between-196 and 85 °C, the residual stress of the diamond/Cu composite materials increases continuously with the increase of the cycle numbers, the increase of residual stress leads to a small amount of interface debonding, an increase of the interfacial thermal resistances, and a decrease of the constraints of low-expansion component on material deformation, thus the thermal conductivity decreases slightly and the thermal expansion coefficient increases slightly.
Hong GuoZhi-Hui BaiXi-Min ZhangFa-Zhang YinCheng-Chang JiaYuan-Yuan Han
In this paper,diamond/CuCr and diamond/CuB composites were prepared using the pressure infiltration method.The physical property measurement system(PPMS)was adopted to evaluate the thermal conductivity of diamond/Cu and MoCu composites within the range of100–350 K,and a scanning electron microscope(SEM)was utilized to analyze the microstructure and fracture appearance of the materials.The research indicates that the thermal conductivity of diamond/Cu composite within the range of100–350 K is 2.5–3.0 times that of the existing MoCu material,and the low-temperature thermal conductivity of diamond/Cu composite presents an exponential relationship with the temperature.If B element was added to a Cu matrix and a low-temperature binder was used for prefabricated elements,favorable interfacial adhesion,relatively high interfacial thermal conductivity,and favorable low-temperature heat conduction characteristics would be apparent.
Hong GuoGuang-Zhong WangXi-Min ZhangFa-Zhang YinCheng-Chang Jia
Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature （HPHT） infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters （temperature, pressure, and time）. The improvement in interfacial bonding strength and the maximum thermM conductivity of 750 W/（m.K） were achieved at the optimal sintering parameters of 1200℃, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.
A1N/A1 composites are a potentially new kind of thermal management material for electronic packaging and heat sink applications. The spark plasma sintering （SPS） technique was used for the first time to prepare the A1N/A1 composites, and attention was focused on the effects of sintefing parameters on the relative density, microstructure and, in particular, thermal conductivity behavior of the composites. The results showed that the relative density and thermal conductivity of the composites increased with increasing sintering temperature and pressure. The composites sintered at 1550℃ for 5 min under 70 MPa showed the maximum relative density and thermal conductivity, corresponding to 99% and 97.5 W.m-1.K-1, respectively. However, the thermal conductivity of present A1N/A1 composites is still far below the theoretical value. Possible reasons for this deviation were discussed.
