Three kinds of full compositional distribution （from 0 to 100wt%W） W/Cu FGMs （functionally graded materials） with high density is fabricated by resistance sintering under ultra-high pressure. Microstructure analysis showed that the good grading composition of all FGMs has been obtained. The sintering mechanism of W is mainly solid state sintering. Thermal shock test in air demonstrated that the grading at the interface between W and Cu is effective for the reduction of thermal stress, but obvious transver- se and vertical cracks occur in the pure W layer. The oxidation of the W60Cu40 layer and the W40Cu60 layer is heavier than that of the other layers.
