通过实验研究了印刷电路板(print circuit board,PCB)设计对小尺寸薄型封装(thin small outline package,TSOP)焊点可靠性的影响.实验制作了包含引脚焊盘的长度、焊盘的表面处理方式及背靠背的双面贴装偏移量3种设计参数的可靠性测试板,并采用表面贴装工艺(surface mount technology,SMT)将TSOP器件焊接到测试板上;经-40～85℃的高低温循环试验后,收集了TSOP引脚焊点裂纹的生长数据;讨论了焊点失效的机理,相应考虑了2种可靠性判断准则,并对各参数条件下的裂纹数据进行比较.结果表明,长尺寸焊盘、有机保焊膜(organic solderability preservatives,OSP)及不对称的两面布置方式有助于提高TSOP引脚的焊点可靠性.
The Mn-doped CeO 2 nanopowders with high catalysis activity were successfully fabricated through a simple hydrolyzed-oxidized approach.Firstly,the alloy Ce 37 Mn 18 C 45 was prepared in vacuum induction melting furnace.Subsequently,Mn-doped CeO 2 nanopowders with 142 m 2 /g of specific surface area were obtained through a simple hydrolyzed-oxidized procedure of the alloy.Those nanopowders were heat treated at different temperatures.The obtained materials were characterized by X-ray diffraction(XRD),transmission electron microscopy(TEM),high-resolution transmission electron microscopy(HRTEM) and energy dispersive spectroscopy(EDS).And the catalytic activity on vinyl chloride(VC) emission combustion was investigated.The results showed that those nanopowders after hydrolyzed-oxidized from Ce 37 Mn 18 C 45 mainly consisted of CeO 2 and Mn 3 O 4.Manganese element increased the thermal stability of CeO 2 nanopowders.The Mn-doped CeO 2 nanopowders had three morphologies.Small particles were Mn-doped CeO 2,square particles were Mn 3 O 4 and the rods were Mn 3 O 4 and Mn 2 O 3.The Mn-doped CeO 2 nanopowders had good vinyl chloride(VC) emission catalytic performance.
