Based on the orthodox theory,a model of a single electron transistor （SET） of metallic tunneling junctions is built using the master equation method. Several parameters of the device, such as capacitance, resistance and temperature,are input into the model and thus the I-V curves are attained. These curves are consistent with those from other experiments; therefore, the model is verified. However, there still exists a difference between simulated results and experimental results,mainly comes from the stationary case of the master equation. In other words, precision of simulated results would be increased if the transient case of the master equation is considered. Moreover, the current increases exponentially at higher drain voltages, which is due to the fact that the barrier suppression is caused by the image charge potential.
Partial-depleted SOI(silicon on insulator) nMOS devices are fabricated with and without silicide technology,respectively.Off-state breakdown characteristics of these devices are presented with and without body contact,respectively.By means of two-dimension(2D) device simulation and measuring junction breakdown of the drain and the body,the difference and limitation of the breakdown characteristics of devices with two technologies are analyzed and explained in details.Based on this,a method is proposed to improve off-state breakdown characteristics of PDSOI nMOS devices.
A new method for determining proximity parameters α,β ,and η in electron beam lithography is introduced on the assumption that the point exposure spread function is composed of two Gaussians.A single line is used as test pattern to determine proximity effect parameters and the normalization approach is adopted in experimental data transaction in order to eliminate the need of measuring exposure clearing dose of the resist.Furthermore,the parameters acquired by this method are successfully used for proximity effect correction in electron beam lithography on the same experimental conditions.
