Selective metallization on glass is widely used in the production of printed circuit boards(PCB),display panels and solar cells. Selective masking and etching steps are used in the traditional photolithographic processes to create the regions of metallization on non-conducting substrates; however, these processes require high-cost facilities and complicated operations. To address these issues, a non-photolithographic process to form metal patterns on glass was proposed and put into practice, which combines self-assembly of aminosilane, desktop inkjet printing of a catalyst ink, and selective electroless plating of Au, Cu or Ni-B alloy on the catalyst template to form desired patterns with a minimal line width of about 200 μm. The adherence of the metal layer deposited on glass is significantly enhanced due to the surface modification of self-assembled aminosilane layer. The non-photolithographic approach could be cost-effective for prototype and small patch of production of metallic patterns, simple electric circuits and other electronic device parts.
一种高介电常数(K=7.6～11.6)的有机铁电聚合物材料——偏氟乙烯与三氟乙烯共聚物首次作为介质层用于介质上电润湿效应的数字微流控器件.在30 V的外加电压下,液滴与器件间的固-液接触角可以从118°下降到75°,并且呈现明显的电压极性相关性.基于此现象,设计并制作了新型的单平面电极阵列结构的数字微流控器件,简化了器件结构和工艺流程,整个工艺步骤可以与集成电路工艺兼容.新型器件成功实现了3μL的液滴的往返运输,工作电压只需20 V.
